Copper Foil Surface Inspection System
Detect major and periodic defects on copper foil surfaces and classify them for statistical analysis. This helps identify and resolve anomalies, ensuring both high product quality and efficient mass production. Defect types can also be used to guide process improvements and R&D initiatives.
System Information
Applications
Surface inspection of rolled film materials, including electro-deposited copper foil, rolled copper foil, FCCL, RCC copper foil, aluminum foil, and other thin films.
Inspection Items
Pinholes, copper debris, oxidation, rust spots, backing damage, copper particles, scratches, impurities, wrinkles, crystallization, and other defects.
Inspection Method
High-resolution linear CCD used for high-speed dynamic roll-to-roll process inspection, improving production yield.
Inspection Speed
Maximum line speed up to 120 m/min.
Display Method
Defect images are displayed along with audible, visual, or automatic label warnings.
Inspection Accuracy
Minimum resolution: Surface 10 μm, pinholes 5 μm
Defect Phenomena Reference:
