Copper Foil Substrate Surface Inspection System
Monitor CCL (Copper Clad Laminate) appearance quality. The inspection machine automatically classifies substrates into Grade A or B based on inspection results, achieving up to 40% labor savings and production increase while maintaining stable quality and reducing customer complaints.
System Information
Applications
Applicable to copper-clad substrates of various thicknesses, with or without logo surfaces, installed directly on production lines for in-line inspection.
Inspection Items
Backing damage, particle backing damage, scratches, bright dents, wrinkles, stains, copper particles, oxidation, bright spots, oil stains, fingerprints, markings, improper cutting, and other defects.
Inspection Method
Dynamic process inspection using high-resolution linear CCD.
Inspection Speed
5 seconds per piece.
Warning Method
Defect images displayed with audible and visual alerts
Inspection Accuracy
Minimum resolution: 20 μm
Inspection Parameters
Individually adjustable based on process and substrate thickness.
Actual Machine Operation
Defect Phenomena Reference:
